Electronic communication stamping parts focus on micro connectors, shielding covers and heat sinks, processed using 0.1-0.3mm ultra-thin copper strips and stainless steel strips. Minimum punching diameter reaches 0.8mm, with flatness controlled within 0.02mm/m. Equipped with Japanese precision high-speed punch presses (stamping speed up to 1200 times/minute) and multi-station progressive dies, realizing integrated production of continuous stamping, bending and shaping. Vacuum degreasing cleaning ensures surface oil residue <5mg/m², meeting electronic component welding requirements. Providing customized accessories for Huawei, ZTE, etc., a 5G base station shielding cover passed 3000 insertion/extraction tests without deformation, with stable conductivity and monthly output exceeding 5 million pieces.